Solder pastes FELDER

Solder pastes FELDER

ISO-Cream® SMD FELDER solder pastes ensure a high flexibility.

All ISO-Cream® SMD solder pastes can be adjusted with viscosities between 300 and 900 PA s (according to Brookfield, 5 U/min, TF spindle, 25 °C) according to customer's demand. Advanced testing and control procedures based on national and international standards guarantee 100% continuous, batch-to-batch qualities.


 Cans 250 g und 500 g
 Cartridges 6 und 12 oz Semco®  
 Cartridges ProFlow™ and PuckPack™
 Dispenser cartridge 5, 10 und 30 ccm


   Alloys
 Sn96Ag+®  Sn96.5Ag3Cu0.5NiGe 217 - 219 ºC
 Sn100Ni+®  Sn99.3Cu0.7AgNiGe 227 ºC eutectic
 Sn95.5Ag4Cu0.5 217 ºC eutectic
 Sn96.5Ag3.5 221 ºC eutectic
 Bi58Sn42 138 ºC eutectic


No-clean SMD soft solder pastes

Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics.
ISO-Cream® "EL 5510"
No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours.
Suitable for all reflow applications. (ROL0)
ISO-Cream® "Clear"
No-clean SMD solder paste, best wedding  on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation
ISO-Cream® "EL 3202"
No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1)
ISO-Cream® "EL 3203"
No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1)

SMD special soft soldering pastes

For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics.
ISO-Cream® "RA 2601"
Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed.
ISO-Cream®
"ELW 2303"
Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water.


 Leaded Alloys
 Sn62Pb36Ag2 179 ºC eutectic
 Sn63Pb37 183 ºC eutectic
 Pb93Sn5Ag2 296 - 301 ºC

 Metal proportions
 Dispenser application 85 - 88 %
 Screen printing 88 %
 Stencil printing 88 - 90 %

 Grain sizes
 KG 2 Standard 45 - 75 µm
 KG 3 Fine-Pitch 25 - 45 µm
 KG 4 Superfine-Pitch 20 - 38 µm
 KG 5 Superfine-Pitch 15 - 25 µm

Read more...

Solder paste ISO-Cream EL3202 500g
Content [g]: 500 / Metal content [%]: 90 / Grain size: 3 (25-45 µm)
Content [g]: 500 / Metal content [%]: 90 / Grain size: 3 (25-45 µm)
Article#: FE-238432029060
Solder paste ISO-Cream "EL-3202" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can
(EN 61190-ROL1)
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Solder paste ISO-Cream EL5510 500g
Content [g]: 500 / Metal content [%]: 88 - 89 / Grain size: 3 (25-45 µm)
Content [g]: 500 / Metal content [%]: 88 - 89 / Grain size: 3 (25-45 µm)
Article#: FE-55237655118960
Solder paste ISO-Cream "EL 5510" S Sn96Ag +
(Sn96.5Ag3.0Cu0.5NiGe), flux DIN EN 29454
1.1.3.C (EN61190 ROL0)
Metal powder content 88-89%, particle size 3
500 g can
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Solder paste ISO-Cream EWL 250g
Content [g]: 250 / Metal content [%]: 89 / Grain size: 3 (25-45 µm)
Content [g]: 250 / Metal content [%]: 89 / Grain size: 3 (25-45 µm)
Article#: FE-238423038955
Solder paste ISO-Cream "ELW-2303" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can
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Solder paste ISO-Cream "Clear"
Content [g]: 500 / Metal content [%]: 88.5 / Grain size: 3 (25-45 µm)
Content [g]: 500 / Metal content [%]: 88.5 / Grain size: 3 (25-45 µm)
Article#: FE-238552008960
Solder paste ISO-cream "Clear" Sn96,5Ag3,0Cu0,5
LEAD-FREE. (REL0)
Melting point: 217° - 219°C
Metal powder part 88.5%, particle size 3,
500g can
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