Solder pastes FELDER

Solder pastes FELDER

ISO-Cream® SMD FELDER solder pastes ensure a high flexibility.

All ISO-Cream® SMD solder pastes can be adjusted with viscosities between 300 and 900 PA s (according to Brookfield, 5 U/min, TF spindle, 25 °C) according to customer's demand. Advanced testing and control procedures based on national and international standards guarantee 100% continuous, batch-to-batch qualities.


No-clean SMD soft solder pastes

Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics.
ISO-Cream® "EL 5510"
No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours.
Suitable for all reflow applications. (ROL0)
ISO-Cream® "Clear"
No-clean SMD solder paste, best wedding  on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation
ISO-Cream® "EL 3202"
No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1)
ISO-Cream® "EL 3203"
No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1)

SMD special soft soldering pastes

For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics.
ISO-Cream® "RA 2601"
Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed.
ISO-Cream®
"ELW 2303"
Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water.


 Cans 250 g und 500 g
 Cartridges 6 und 12 oz Semco®  
 Cartridges ProFlow™ and PuckPack™
 Dispenser cartridge 5, 10 und 30 ccm


   Alloys
 Sn96Ag+®  Sn96.5Ag3Cu0.5NiGe 217 - 219 ºC
 Sn100Ni+®  Sn99.3Cu0.7AgNiGe 227 ºC eutectic
 Sn95.5Ag4Cu0.5 217 ºC eutectic
 Sn96.5Ag3.5 221 ºC eutectic
 Bi58Sn42 138 ºC eutectic


 Leaded Alloys
 Sn62Pb36Ag2 179 ºC eutectic
 Sn63Pb37 183 ºC eutectic
 Pb93Sn5Ag2 296 - 301 ºC

 Metal proportions
 Dispenser application 85 - 88 %
 Screen printing 88 %
 Stencil printing 88 - 90 %

 Grain sizes
 KG 2 Standard 45 - 75 µm
 KG 3 Fine-Pitch 25 - 45 µm
 KG 4 Superfine-Pitch 20 - 38 µm
 KG 5 Superfine-Pitch 15 - 25 µm

Solder paste ISO-Cream EL3202 500g
500 / 90 / 3 (25-45 µm)
500 / 90 / 3 (25-45 µm)
Article#: FE-238432029060
ISO-Cream® Solder paste EL 3202 Sn95.5Ag4Cu0.5 LEAD-FREE, flux DIN EN 29454, 1.1.3.C (EN 61190-ROL1) Metal powder content 90 %, particle size 3 ,
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Solder paste ISO-Cream EL5510 500g
500 / 88 - 89 / 3 (25-45 µm)
500 / 88 - 89 / 3 (25-45 µm)
Article#: FE-55237655118960
 Alloy: Sn96.5Ag3Cu0.5NiGe    bleifrei    Melting point: 217 °C - 219 °C
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Solder paste ISO-Cream EWL 250g
250 / 89 / 3 (25-45 µm)
250 / 89 / 3 (25-45 µm)
Article#: FE-238423038955
 Alloy: Sn95.5Ag4Cu0.5    lead-free Melting point: 217 °C eutectic
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Solder paste ISO-Cream "Clear"
500 / 88.5 / 3 (25-45 µm)
500 / 88.5 / 3 (25-45 µm)
Article#: FE-238552008960
 Alliage: Sn96.5Ag3.0Cu0.5    lead-free Melting point: 217 – 219°C
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