HTS / HTSP Silicone-based thermally conductive compound
dpvlink 2806

Silicon-based thermal conductive paste

Excellent anti-creep properties

Thermal conductivity: 0.9 W/m.K (HTS) / 3.0 W/m.K (HTSP)

Large temperature range

Low weight loss due to volatilization

Economical and easy to use

: 0.9 W/m.K (HTS) / 3.0 W/m.K (HTSP)

Large temperature range

Low weight loss due to volatilization

Economical and easy to use