Electronic solders ISO Tin® are made of pure metals of first melt.
Product | Alloy | Melting range | Application |
Sn100Ni+®** | Sn99.3Cu0.7AgNiGe | 227 °C eutectic | Wave soldering, selective soldering |
Sn100C®* | Sn99.3Cu0.7NiGe | 227 °C eutectic | Wave soldering, selective soldering |
Sn99Ag+®** | Sn99Ag0.3Cu0.7NiGe | 217 °C - 222 ºC | Wave soldering, selective soldering |
Sn98Ag+® ** | Sn98Ag1.2Cu0.7NiGe | 217 °C - 222 ºC | Wave soldering, selective soldering |
Sn96Ag+® ** | Sn96.5Ag3.0Cu0.5NiGe | 217 °C eutectic | Wave soldering, selective soldering |
Sn95Ag+® ** | Sn95.5Ag3.8Cu0.7NiGe | 217 °C eutectic | Wave soldering, selective soldering |
Sn96.5Ag3.0Cu0.5 | Sn96.5Ag3.0Cu0.5 | 217 °C eutectic | Wave soldering, selective soldering |
SAC* | Sn95.5Ag3.8Cu0.7 | 217 °C eutectic | Wave soldering, selective soldering |
Sn96.5Ag3.5 | Sn96.5Ag3.5 | 221 °C eutectic | Wave soldering, selective soldering |
Sn99.3Cu0. 7 | Sn99.3Cu0.7 | 227 °C eutectic | Wave soldering, selective soldering |
Sn63Pb37 | Sn63Pb37 | 183 °C eutectic | Wave soldering, selective soldering |
Sn60Pb40 | Sn60Pb40 | 183 ºC - 190 °C | Wave soldering, selective soldering |
* NIHON Superior patent DE No. 69918758; Europe patent No. 0985486
** Fuji patent: DE Patent No. 19816671C2; US Patent No. 6.179.935B1; Japan Patent No. 3296289
All electronic solders are also available as refill solder without copper.