Solders and soldering agents

High-quality solders and soldering agents form the basis for reliable soldered connections. The range includes bar solder and solder wire for precise electrical connections as well as solder paste for the finest applications. Desoldering braids and flux removers enable clean rework, while flux pens simplify the targeted application of flux. Automatic solder wire feeders and solder dispensers support efficient and reproducible dosing. With these products, soldering processes can be optimized and high-quality results achieved.

 

Our Brands

Chemtronics Electrolube Felder JBC Piergiacomi Vieweg Weller
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FELDER solder bars ISO-Tin® Sn100Ni+
Melting point: 227 °C / Form: Bars / Weight : approx. 250 g
FELDER electronics solder ISO Tin "Sn99.3CuNiGe"
according to Fuji-Pat-No. DE 19816671C2
approx. 400 g bars, 20 kg cartons

Product No.: FE-5512941026
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FELDER Solder bar Sn100C
Melting point: 227 °C / Form: Bars / Weight : approx. 1000g g
Electronics solder Felder "SN100C"
Sn99,3CuNiGe0,0055
melting point 227°C
according to NIHON-SUPERIOR-Pat.No. EP 0985486B1
bars, ca. 1000g, 330 x 20 x 20 mm

Product No.: FE-5612940040
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The image shows a spool of solder wire with a diameter of 0.50 mm. The spool is silver-colored and is located in a green, round container.
Solder wire ISO-Core® RA Sn100Ni+
Solder wire ISO-Core® RA Sn100Ni+
Lead-free: Yes / Alloy: Sn99,3Cu0,7AgNiGe / Melting point: 227 °C / Flux percentage: 2,5 % / Ø: 0.5 mm
Solder wire ISO-Core® RA Sn100Ni+
Lead-free: Yes / Alloy: Sn99,3Cu0,7AgNiGe / Melting point: 227 °C / Flux percentage: 2,5 % / Ø: 0.75 mm
Solder wire ISO-Core® RA Sn100Ni+
Lead-free: Yes / Alloy: Sn99,3Cu0,7AgNiGe / Melting point: 227 °C / Flux percentage: 2,5 % / Ø: 1.0 mm

3 Products
Product No.: FE-5518940520
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The image shows a spool of solder. The spool has a green edge and on it, there is a label with technical information, such as diameter and weight.
Solder wire ISO-Core® ELR Sn100Ni+®
Solder wire ISO-Core® ELR Sn100Ni+
Lead-free: Yes / Melting point: 183 - 190 °C / Alloy: Sn99.3CuNiGe / Flux percentage: 1 % / Weight : 250 g / Ø: 0.5 mm
Solder wire ISO-Core® ELR Sn100Ni+
Lead-free: Yes / Melting point: 183 - 190 °C / Alloy: Sn99.3CuNiGe / Flux percentage: 1 % / Weight : 500 g / Ø: 0.75 mm
Solder wire ISO-Core® ELR Sn100Ni+
Lead-free: Yes / Melting point: 183 - 190 °C / Alloy: Sn99.3CuNiGe / Flux percentage: 1 % / Weight : 500 g / Ø: 1.0 mm

3 Products
Product No.: FE-554094052010
Price on request
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Solder wire ISO-Core® ELR Sn99.3Cu0.7
Solder wire ISO-Core® ELR Sn99.3Cu0.7
Lead-free: Yes / Melting point: 227 °C / Alloy: Sn99,3Cu0,7 / Flux percentage: 1 % / Weight : 250 g / Ø: 0.5 mm
Solder wire ISO-Core® ELR Sn99.3Cu0.7
Lead-free: Yes / Melting point: 227 °C / Alloy: Sn99,3Cu0,7 / Flux percentage: 1 % / Weight : 500 g / Ø: 0.75 mm
Solder wire ISO-Core® ELR Sn99.3Cu0.7
Lead-free: Yes / Melting point: 227 °C / Alloy: Sn99,3Cu0,7 / Flux percentage: 1 % / Weight : 500 g / Ø: 1.0 mm

3 Products
Product No.: FE-4094052010
Price on request
to the product family
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Solder wire ISO-Core® ELR S-Sn60Pb40
Solder wire ISO-Core® ELR S-Sn60Pb40
Lead-free: No / Melting point: 183 - 190 °C / Alloy: Sn60Pb40 / Flux percentage: 1 % / Weight : 250 g / Ø: 0.5 mm
Solder wire ISO-Core® ELR S-Sn60Pb40
Lead-free: No / Melting point: 183 - 190 °C / Alloy: Sn60Pb40 / Flux percentage: 1 % / Weight : 500 g / Ø: 0.75 mm
Solder wire ISO-Core® ELR S-Sn60Pb40
Lead-free: No / Melting point: 183 - 190 °C / Alloy: Sn60Pb40 / Flux percentage: 1 % / Weight : 500 g / Ø: 1.0 mm

3 Products
Product No.: FE-4060052010
Price on request
to the product family
The image shows a round, white plastic pot with a screw lid. It has the inscription
Solder paste ISO-Cream EL3202 500g
Content : 500 g / Metal content [%]: 90 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "EL-3202" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can
(EN 61190-ROL1)

Product No.: FE-238432029060
Price on request
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The image shows a round, white plastic pot with a screw lid. It has the inscription
Solder paste ISO-Cream EWL 250g
Content : 250 g / Metal content [%]: 89 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "ELW-2303" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can

Product No.: FE-238423038955
Price on request
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The image shows a round, white plastic pot with a screw lid. It has the inscription
Solder paste ISO-Cream "Clear"
Content : 500 g / Metal content [%]: 88.5 % / Grain size: 3 (25-45 µm)
Solder paste ISO-cream "Clear" Sn96,5Ag3,0Cu0,5
LEAD-FREE. (REL0)
Melting point: 217° - 219°C
Metal powder part 88.5%, particle size 3,
500g can

Product No.: FE-238552008960
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