Hot air stations enable targeted, controlled heating via an adjustable hot air flow, which is used for the thermal processing of soldered connections. Thanks to an even temperature distribution, components can be heated gently without thermally overloading surrounding structures or the circuit board.
They are used for desoldering and soldering surface-mounted components (SMD), particularly in repair and rework processes. Hot air stations are also used for reflow processes in prototype construction, the curing of adhesives or the shrinking of heat-activated materials such as heat-shrink tubing.
Systems with precise temperature profile control and optional preheating function are used for the rework of complex components such as BGA (ball grid array) components to ensure controlled soldering processes.