Epoxy potting compound ER2183RP250G, 250 g packing

(Product No.: ER2183RP250G)

Epoxy potting compound ER2183RP250G, 250 g packing

ArticleNo: ER2183RP250G

dpvlink:

2819

Packaging type:

bag

Content :

250 g

PU:

10 piece

Properties:

Note:

- only complete packaging units (PU) available -

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Product Info

Epoxy potting compound ER2183RP250G, 250 g packing

The Electrolube ER2183RP250G epoxy encapsulant is a high-quality solution for encapsulating and sealing electronic components. This product is characterized by its thermal conductivity and low viscosity, making it ideal for applications involving small electronic assemblies and narrow gaps requiring efficient heat dissipation. The compound is easy to mix as it uses no abrasive fillers, and covers a wide operating temperature range from -40°C to +130°C.
The specific thermal conductivity is 1.25 W/m*K. Additionally, this product meets the UL94-V0 requirements, which means it exhibits a relatively low level of toxic gases and smoke release in the event of a fire and is RoHS compliant. The epoxy encapsulant is available in a 250 g package, which is bagged, and has a shelf life of 18 months. The packaging unit includes 10 pieces. With its black color and excellent adhesive properties, this product provides a reliable solution for various encapsulation tasks.

Details

Packaging type Packaging type: bag
Content Content: 250 g
PU PU: 10 piece
Color Color: black
Shelf life Shelf life: 2 years , 18 months

- only complete packaging units (PU) available -

Pictograms

GHS05

Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)

GHS07

General hazardous effect:
For substances and mixtures that irritate the eyes, skin or respiratory tract or have any other harmful effect

GHS09

Substances and mixtures that acutely or chronically endanger water bodies and thus the environment

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Product Family

Epoxy potting compound

Epoxy potting compounds are special synthetic resins that are produced on an epoxy resin basis and are used for potting and sealing components. They usually consist of two components: an epoxy resin and a hardener, which are mixed together to start a chemical reaction that results in a solid, durable compound. They are resistant to mechanical stress and resistant to many chemical products (e.g. solvents). Epoxy resins have good insulating properties and remain stable even at high temperatures. They also have good adhesive properties.

Comparison table

Epoxy resin	ER2188	ER2074	ER2183
Color (mixed system)	black	white	black
Density in cured state (g/ml)	1.69	2.09	1.95
Viscosity of the mixed system (in mPa s at 23°C)	9000	16700	5000
Mixing ratio by weight (by volumen)	11:1 (5.5 : 1)	17.31 : 1 (7.23 : 1)	12.78 : 1 (5.58 : 1)
Pot life (in minutes at 23°C)	60	90	120
Setting time (in minutes at 23°C)	150	300	420
Curing time (in hours at 23°C / 60°C)	24/2	24/4	24/4
Thermal conductivity (W/m.K)	0.91	1.26	1.25
Temperature range (°C)	-40 to +120	-40 to +130	-40 to +130
Maximum short-term temperature (°C)	+140	+150	+150
Dielectric strengtht (kV/mm)	10	10	10
Volume resistance (Ω·cm)	10¹⁴	10¹⁵	10¹⁵
Shore hardness	D85	D80	D90
Flame retardancy	V-0	V-0	V-0
UL94 certification	yes	no	no
RoHs compliant	yes	yes	yes