Solder pastes

Solder paste is a key consumable in SMD production. It consists of a homogeneous mixture of flux and fine metal particles and is used to temporarily fix components on PCBs before the reflow soldering process. Uniform application and high quality of the solder paste are crucial for reliable solder connections, reduce error rates and contribute to functionality and process reliability in electronics production.

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Solder paste ISO-Cream "Clear"
Content : 500 g / Metal content [%]: 88.5 % / Grain size: 3 (25-45 µm)
Solder paste ISO-cream "Clear" Sn96,5Ag3,0Cu0,5
LEAD-FREE. (REL0)
Melting point: 217° - 219°C
Metal powder part 88.5%, particle size 3,
500g can

Product No.: FE-238552008960
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Solder paste ISO-Cream EL3202 500g
Content : 500 g / Metal content [%]: 90 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "EL-3202" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can
(EN 61190-ROL1)

Product No.: FE-238432029060
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Solder paste ISO-Cream EL5510 500g
Content : 500 g / Metal content [%]: 88 - 89 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "EL 5510" S Sn96Ag +
(Sn96.5Ag3.0Cu0.5NiGe), flux DIN EN 29454
1.1.3.C (EN61190 ROL0)
Metal powder content 88-89%, particle size 3
500 g can

Product No.: FE-55237655118960
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Solder paste ISO-Cream EWL 250g
Content : 250 g / Metal content [%]: 89 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "ELW-2303" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can

Product No.: FE-238423038955
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