Potting compounds

• UL approved

• Encapsulation and potting

• Seals, cable connection

• Protection and sealing

The potting compounds systems are designed to insulate and protect electrical and electronic components from the dangers of a rough and challenging environment, moisture, vibration, thermal and physical shocks, as well as general pollution.

Potting compounds can form a complete barrier against environmental influences, a complete insulation of assembly parts and are better suited for the operation under extreme conditions than protective lacquers.

Potting compound types used in the electronics industry are epoxy resin and polyurethane.

Epoxy resins

They usually have a higher temperature performance than polyurethanes, shrink less while hardening, are harder and stronger, and can be made more flame-retardant. They provide a better adhesion, are more resistant to humidity during and after the hardening as well as to chemicals.

Polyurethanes

In comparison with epoxy resins, they are generally softer, more flexible and really elastomeric and therefore they cause a reduced load of the protected components. They offer a much faster hardening at low temperatures, have a much better resistance to abrasion and a lower operating temperature (up to -60°C).

Packaging

Bag
Two-component packaging containing resin and hardener in the correct ratio in a plastic bag.

Kits
Resin and hardener  in the correct ratio are delivered in two containers.

Large quantities
Resin and hardener are delivered in separate containers and must be mixed together in the correct ratio.

Mixture of the bag
These potting compounds are two-component systems corresponding to the mixing ratio hardener and resin. Hardener and resin are packed in a plastic package separated by a clip. If the clip is removed, the pack can be thoroughly mixed and is ready to use. Cut a corner of the pack and put the compound.